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Published on
Friday, October 2, 2026 at 05:09 AM

By Victoria Hayes — Far-Right Desk

Midea Pitches Integrated Cooling for AI Data Centers

Midea Building Technologies presented power and cooling systems for high-density AI data centers at Asia Data Centre World 2026, held at Marina Bay Sands in Singapore from September 29 to 30. The company said its products target Asia-Pacific facilities contending with high computing demand, liquid-cooling requirements, tropical climates and pressure to reduce carbon emissions.

The announcement focused on data-center infrastructure and commercial collaboration. It didn’t describe changes to national authority, migration or demographic policy. The central proposal: coordinate electrical supply and cooling equipment as a unified system during planning and construction.

Integrated infrastructure

Midea Building Technologies described its power-cooling hyperconverged architecture as the industry’s first. The system brings power equipment, energy storage, magnetic bearing cooling sources and liquid-cooling computer room distribution units, or CDUs, into one infrastructure stack. It links power supply, storage, cooling and liquid-cooling distribution from the early stages of construction.

The company also released a technical white paper on the architecture’s technology pathway for planning, constructing and operating AI data centers. According to the announcement, the paper offers a quantifiable, replicable technical reference for integrating electrical and thermal systems.

As rack power density rises, the company said, its system-level design aims to improve coordination between power supply and cooling. The approach coordinates magnetic bearing cooling sources, free cooling and liquid-cooling terminals. That coordination reduces reliance on mechanical cooling and supports improved power usage effectiveness, or PUE, and low-carbon operation, the announcement said.

Cooling products and operating conditions

Midea Building Technologies presented a full-stack cooling solution connecting cooling sources, cooling distribution and terminal heat dissipation. The company said it’s designed to manage temperatures amid complex climate conditions and resource constraints.

The Magnetic CDU combines a magnetic bearing cooling source with a distribution unit, replacing a separate chiller and passive CDU. It can cut equipment footprint by up to 70%, shorten deployment cycles and support a PUE below 1.2 under suitable operating conditions, the announcement said.

For hot, water-scarce environments, the company designed the Air-Cooled Magnetic Centrifugal Chiller. Midea Building Technologies said the unit reduces dependence on cooling water and delivers a coefficient of performance, or COP, of up to 5.4.

The Industrial-Grade CDU provides 2.6 megawatts of cooling capacity at a 3K temperature difference. It supports liquid-cooling distribution for large AI clusters and high-density racks, with high availability, the company said.

Partnership and service network

At the exhibition, Midea Building Technologies highlighted its collaboration with Keppel on green data-center infrastructure. The partnership covers design, delivery and operation. In China, the Gui'an Midea Cloud Data Center combines Midea Building Technologies hardware with Keppel’s digital platform. According to the release, the facility provides up to 7,654 hours of annual free cooling and maintains a stable PUE below 1.2. The company presented it as a replicable model for green data-center development in Asia-Pacific AI infrastructure markets.

Midea Building Technologies said its support includes what it called the world’s first fully AI-powered chiller Lighthouse Factory, 193 local service sites across 29 countries and spare-parts centers in 34 countries. The company said it’s prepared to support data centers across Asia Pacific.

Visitors crowded the exhibition hall, according to the release. Industry customers, partners and technical experts attended discussions on AI infrastructure upgrades, energy-efficiency optimization and liquid-cooling technology. The item was labeled a press release, and it identified the issuer as solely responsible for the announcement’s content.

Reviewed by the editorial desk — October 2, 2026
Last updated October 2, 2026

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