The U.S. Department of Commerce plans to award GlobalFoundries $300 million. This substantial funding aims to support the development of faster AI chip links. It will also advance co-packaged optics, known as CPO. CPO technology integrates silicon photonics directly alongside AI processors. This integration is designed to boost data-transfer speeds and enhance energy efficiency.
Reviewed by the editorial desk — July 29, 2026
Last updated July 29, 2026